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LM2641 датащи(PDF) 11 Page - National Semiconductor (TI) |
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LM2641 датащи(HTML) 11 Page - National Semiconductor (TI) |
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11 / 18 page ![]() Theory of Operation (Continued) losses. The load current value where the transition from fixed-frequency to pulse-skipping operation occurs is the point where the inductor current goes low enough to cause the voltage measured across the current sense resistor (R4 or R13) to drop below 25 mV. In pulse-skipping mode, the high-side FET switch will turn ON at the beginning of the first clock cycle which occurs after the voltage at the feedback pin falls below the reference volt- age. The high-side FET switch remains ON until the voltage across the current sense resistor rises to 25 mV (and then it turns OFF). Ramp Compensation All current-mode controllers require the use of ramp com- pensation to prevent subharmonic oscillations, and this com- pensation is built into the LM2641. The internal compensa- tion assumes an R SENSE value of 25 mΩ, inductor value of 6.8µH, and a maximum output voltage of 6V. To prevent oscillations, the slope M of the compensation ramp must be equal to the maximum downward slope of the voltage waveform at the output of the current sense ampli- fier. The relationship of the slope M to the external compo- nents is given by: M COMP = MCS AMP (max) = NXRSENSE XVOUT (max) / L Where: M COMP is the slope of the compensation ramp. M CS AMP (max) is the maximum downward slope of the volt- age at the output of the current sense amplifier. N is the gain of the current sense amplifier. R SENSE is the value of the current sense resistor. V OUT (max) is the maximum output voltage. L is the inductance of the output inductor. It is important to note that since the value R SENSE appears in the numerator and L is in the denominator, these two values may be increased or decreased at the same ratio without changing the slope. At higher values of load current, a lower value R SENSE will be selected. The inductance value for the output inductor should be decreased by the same percentage to maintain correct ramp compensation. Application Information Improved Transient Response If the output voltage falls below 97% of the nominal value, the low-voltage regulation (LREG) comparator will activate logic which turns ON the high-side FET switch continuously until the output returns to nominal. The low-side FET switch is held OFF during this time. This action will improve transient response since it bypasses the error amplifier and PWM comparator, forcing the high-side switch ON until the output returns to nominal. This feature is disabled during start-up. Boost High-Side Gate Drive A “flying” bootstrap capacitor is used to generate the gate drive voltage used for the high-side FET switch. This boot- strap capacitor is charged up to about 5V using an internal supply rail and diode when ever the low-side FET switch is ON. When the high-side FET switch turns ON, the Source is pulled up near the input voltage. The voltage across the bootstrap capacitor boosts up the gate drive voltage, ensur- ing that the Gate is driven at least 4.3V higher than the Source. Reference The internal bandgap reference is used to generate a 2.5V reference voltage which is connected to the REF pin. The guaranteed tolerance of the REF voltage is ±2% over the full operating temperature range, as long as the current drawn is ≤ 5 mA. A bypass capacitor on the REF pin is not required, but may be used to reduce noise. 5V LIN Output The LM2641 contains a built-in 5V/50 mA LDO regulator whose output is connected to the LIN pin. Since this is an LDO regulator, it does require an external capacitor to main- tain stability. A good quality Tantalum capacitor ≥ 4.7µF is recommended. Since the current limit for this LDO regulator is set at about 85 mA, it can be used at load currents up to about 50 mA (assuming total IC power dissipation does not exceed the maximum value). Guaranteed specifications are provided for worst-case val- ues of V LIN over the full operating temperature range for load currents up to 25mA (see Electrical Characteristics). To esti- mate how the V LIN output voltage changes when going from I LIN = 25mA to ILIN = 50mA, a change in VLIN of about −30mV should be expected due to loading (typical value only, not guaranteed). This decrease in V LIN is linear with in- creasing load current. It must be understood that the maximum allowable current of 50mA must include the current drawn by the gate drive cir- cuitry. This means that the maximum current available for use at the LIN pin is 50 mA minus whatever is being used in- ternally for gate drive. The amount of current used for gate drive by each switching output can be calculated using the formula: I GD =2XQXFOSC Where: I GD is the gate drive current supplied by VLIN. Q is the gate charge required by the selected FET (see FET data sheet: Gate Charge Characteristics). F OSC is the switching frequency. Example: As shown in the typical application, if the FET NDS8410 is used with the LM2641, the turn-on gate voltage (V GS)is5V−VDIODE = 4.3V. Referring to the NDS8410 data sheet, the curve Gate Charge Characteristics shows that the gate charge for this value of V GS is about 24 nC. Assuming 300 kHz switching frequency, the gate drive cur- rent used by each switching output is: I GD = 2XQXFOSC = 2X(24X10−9)X(3X105) = 14.4 mA If both outputs are switching, the total gate drive current drawn would be twice (28.8 mA). Note that in cases where the voltage at switching output #1 is 4.8V or higher, the internal gate drive current is obtained from that output (which means the full 50 mA is available for external use at the LIN pin). www.national.com 11 |
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