LM2640 datasheet(7/18 Pages) NSC

7 / 18 page

Electrical Characteristics (Continued)

Typicals and limits appearing in regular type apply for T

J = 25˚C. Limits appearing in boldface type apply over the entire junc-

tion temperature range for operation, 0 to +125˚C. Unless otherwise specified under the Parameter or Conditions columns, V

= 10V, and V

SD =VON/OFF1 =VON/OFF2 = 5V. (Note 2), (Note 6) and (Note 7)

Symbol

Parameter

Conditions

Typical

Limit

Units

COMP1,ICOMP2

COMP Output Source Current

FB1 =VFB2 = 1V, VCOMP1 =

COMP2 =1V

µA

µA(min)

COMP1,ICOMP2

COMP Output Sink Current

FB1 =VFB2 = 1.4V, VCOMP1 =

COMP2 = 0.2V

µA

µA(min)

Voltage References and Linear Voltage Regulator

Bandgap Voltage

1.238

REF

Reference Voltage

0.01 mA

≤ I

REF ≤ 5 mA Source,

LIN ≤ 6V

2.5

2.45

V(min)

2.55

V(max)

0.01 mA

≤ I

REF ≤ 5 mA Source,

LIN ≤ 6V

−40˚C

≤ T

J ≤ +125˚C

2.5

2.45

V(min)

2.555

V(max)

LIN

Output Voltage of the Linear

Voltage Regulator

≤ V

IN ≤ 30V,

0mA

≤ I

LIN ≤ 25 mA

4.6

V(min)

5.4

V(max)

UVLO

Undervoltage Lockout

Threshold

(Note 11)

4.0

3.6

V(min)

4.4

V(max)

(Note 11)

4.0

3.6

V(min)

−40˚C

≤ T

J ≤ +125˚C

4.42

V(max)

LIN-to-V

OUT Switch-Over

Threshold

OUT taken at CSL1

4.8

Logic Inputs

Minimum High Level Input

Voltage (SD, ON/OFF1,

ON/OFF2, and SYNC)

2.4

V(min)

−40˚C

≤ T

J ≤ +125˚C

2.45

V(min)

Minimum High Level Input

Voltage (2NDFB/FPWM)

2.6

V(min)

Maximum Low Level Input

Voltage (SD, ON/OFF1,

ON/OFF2, SYNC, and

2NDFB/FPWM)

0.8

V(max)

Maximum Input Leakage

Current (SD, ON/OFF1,

ON/OFF2, and SYNC)

Logic Input Voltage 0 or 5V

±0.1

µA

Note 1: Unless otherwise specified, all voltages are with respect to the voltage at the GND and PGND pins.

Note 2: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device

is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical

Characteristics tables.

Note 3: The Absolute Maximum power dissipation depends on the ambient temperature. The 883 mW rating results from substituting 150˚C, 70˚C, and 90.6˚C/W

for TJmax,TA, and θJA respectively into the formula Pmax =(TJmax -TA)/θJA, where Pmax is the Absolute Maximum power dissipation, TJmax is the Absolute Maximum

junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance of the package. A θJA of 90.6˚C/W represents the

worst-case condition of no heat sinking of the 28-pin TSSOP. Heat sinking allows the safe dissipation of more power. The Absolute Maximum power dissipation must

be derated by 11.04 mW per ˚C above 70˚C ambient. The LM2640 actively limits its junction temperature to about 150˚C.

Note 4: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation.

Note 5: For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 k

Ω resistor.

Note 6: A typical is the center of characterization data taken with TA =TJ = 25˚C. Typicals are not guaranteed.

Note 7: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TA = 25˚C. All hot and cold limits are

guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.

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