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CAT24C01 датащи(PDF) 17 Page - ON Semiconductor

номер детали CAT24C01
подробное описание детали  1-Kb, 2-Kb, 4-Kb, 8-Kb and 16-Kb I2C CMOS Serial EEPROM
PDF  23 Pages
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CAT24C01 датащи(HTML) 17 Page - ON Semiconductor

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CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
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17
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE B
DIM
A
MIN
MAX
MIN
MAX
INCHES
1.90
2.10
0.075
0.083
MILLIMETERS
B
2.20
2.40
0.087
0.094
C
0.60
0.90
0.024
0.035
D
0.17
0.25
0.007
0.010
F
0.20
0.35
0.008
0.014
G
0.50 BSC
0.020 BSC
H
0.40 REF
0.016 REF
J
0.10
0.18
0.004
0.007
K
0.00
0.10
0.000
0.004
L
3.00
3.20
0.118
0.126
M
0
6
0
6
N
5
10
5
10
P
0.23
0.34
0.010
0.013
R
0.23
0.33
0.009
0.013
S
0.37
0.47
0.015
0.019
U
0.60
0.80
0.024
0.031
V
0.12 BSC
0.005 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED
±0.0508 (0.0002 “).
L
B
A
P
G
4
1
5
8
C
K
D
SEATING
J
S
R
U
DETAIL E
V
F
H
N
R 0.10 TYP
M
−Y−
−X−
−T−
DETAIL E
T
M
0.10 (0.004)
XY
T
0.10 (0.004)
__
__
__
__
PLANE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
mm
inches
SCALE 8:1
3.8
0.15
0.50
0.0197
1.0
0.0394
0.30
0.012
1.8
0.07



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