STF20100S datasheet(3/5 Pages) SMC

3 / 5 page

SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N1701, Rev. -

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

STF20100S

Electrical Characteristics:

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Junction Temperature

-55 to +150

°C

Storage Temperature

Tstg

-55 to +150

°C

Typical Thermal Resistance

Junction to Case

(per leg)

RθJC

DC operation

5.0

°C/W

Approximate Weight

Case Style

ITO-220AB

Characteristics

Symbol

Condition

Typ.

Max.

Units

Forward Voltage Drop (per

leg)*

VF1

@ 5A, Pulse, TJ = 25 °C

@ 10A, Pulse, TJ = 25 °C

@ 20A, Pulse, TJ = 25 °C

0.47

0.54

0.68

0.75

VF2

@ 5A, Pulse, TJ = 125 °C

@ 10A, Pulse, TJ = 125 °C

@ 20A, Pulse, TJ = 125 °C

0.38

0.51

0.64

0.70

Reverse Current at DC

condition (per leg)

IR1

@VR = 70V,TJ = 25 °C

@VR = 100V,TJ = 25 °C

0.012

0.030

Reverse Current (per leg) *

IR2

@VR = 70V,TJ = 125 °C

@VR = 100V,TJ = 125 °C

Junction Capacitance

(per leg)

@VR = 5V, TC = 25 °C

fSIG = 1MHz

845

RSM Isolation Voltage

(t = 1.0 second, R. H. <

=30%,

TA = 25 °C)

VISO

Clip mounting, the epoxy body

away from the heatsink edge by

more than 0.110" along the lead

direction.

4500

Clip mounting, the epoxy body is

inside the heatsink.

3500

Screw mounting, the epoxy body is

inside the heatsink.

1500

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