THS4150, THS4151

HIGHSPEED DIFFERENTIAL I/O AMPLIFIERS

SLOS321D − MAY 2000 − REVISED JANUARY 2004

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICES

EVALUATION

TA

SMALL OUTLINE

MSOP PowerPAD



MSOP

EVALUATION

MODULES

TA

SMALL OUTLINE

(D)

(DGN)

SYMBOL

(DGK)

SYMBOL

MODULES

0

°C to 70°C

THS4150CD

THS4150CDGN

AQB

THS4150CDGK

ATT

THS4150EVM

0

°C to 70°C

THS4151CD

THS4151CDGN

AQD

THS4151CDGK

ATU

THS4151EVM

−40

°C to 85°C

THS4150ID

THS4150IDGN

AQC

THS4150IDGK

AST

−

−40

°C to 85°C

THS4151ID

THS4151IDGN

AQE

THS4151IDGK

ASU

−

±16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

125

°C

. . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I suffix

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD ratings:

HBM

2500 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CDM

1500 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MM

200 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The THS415x may incorporate a PowerPad

dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could

permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPad



thermally enhanced package.

NOTE 2: The absolute maximum temperature under any condition is limited by the constraints of the silicon process.

NOTE 3: The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

DISSIPATION RATING TABLE

PACKAGE

θJA ‡

θJC

POWER RATING§

PACKAGE

θJA ‡

(

°C/W)

θJC

(

°C/W)

TA = 25°C

TA = 85°C

D

97.5

38.3

1.02 W

410 mW

DGN

58.4

4.7

1.71 W

685 mW

DGK

260

54.2

385 mW

154 mW

‡ This data was taken using the JEDEC standard High−K test PCB.

§ Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to

substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or

below 125

°C for best performance and long term reliability.

recommended operating conditions

MIN

TYP

MAX

UNIT

Supply voltage, VCC+ to VCC−

Dual supply

±2.5

±15

V

Supply voltage, VCC+ to VCC−

Single supply

5

30

V

C suffix

0

70

°C

I suffix

−40

85

°C

PowerPAD is a trademark of Texas Instruments.