1

MB2F THRU MB10F

SINGLE PHASE1.0AMPS. GLASS PASSIVATED BRIDGE RECTIFIERS

FEATURE

.

Glass passivated junction.

.

Ideal for printed circuit board.

.

Reliable low cost construction utilizing

molded plastic technique.

.

High surge current capability.

.

High temperature soldering guaranteed:

260℃/10 seconds at terminals.

MECHANICAL DATA

.

Case Material: “Green” Molding compound,

UL flammability classification rating 94V-0,

“Free halogen”

.

Moisture sensitivity level:level 2a,per J-STD-020

.

Polarity:Polarity as marked on the body

.

Weight: 0.105g (approximately)

MBF

-

+

.177(4.5)

.0

20(0.5)

.09

1(2.3)

.193(4.9)

.106(2.7)

.036(0.9)

+

-

.165(4.2)

.276(7.0)M AX

.043(1.1)

.150(3.8)

.012(0.3)

.008(0.2)

.020(0.5)

.031(0.8)

.01

6(0.4)

.008(0.2)M AX

.05

1(1.3)

.059(1.5)

Dimensions in inches and (millimeters)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25℃ ambient temperature unless otherwise specified.

Single phase, half wave, 60Hz,resistive or inductive load.

For capacitive load, derate current by 20%

Type Number

SYM

BOL

MB2F

MB4F

MB6F

MB8F

MB10F

units

Maximum Recurrent Peak Reverse Voltage

200

400

600

800

1000

V

Maximum RMS Voltage

140

280

420

560

700

V

Maximum DC blocking Voltage

200

400

600

800

1000

V

Maximum Average Forward rectified Current

1.0

A

Peak Forward Surge Current 8.3ms single half

sine-wave superimposed on rate load (JEDEC

method)

30

A

Maximum Instantaneous

Forward Voltage

1.1

0.95

V

at rated DC blocking voltage

5.0

100.0

μA

3.74

Typical Junction Capacitance Per Leg (Note1)

13

pF

Typical Thermal Resistance (Note2)

25

85

°C /W

Storage Temperature

-55 to +150

°C

Operating Junction Temperature

-55 to +150

°C

Note:

1. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc

2. Thermal resistance junction to case, lead and ambient in accordance with JESD-51.

Unit mounted on glass-epoxy substrate with 1oz/ft2_10x10 mm copper pad per pin with heatsink