SAW FILTER

HDF1575A

S-6

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Page 6 of 9

5. ENVIRONMENTAL CHARACTERISTICS

5-1 Temperature cycling

Subject the device to a low temperature of -40℃ for 30 minutes. Following by a

high temperature of +85℃ for 5 Minutes and a higher temperature of +85℃ for 30

Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the

measurement. It shall meet the specifications in 4.3.

5-2 Resistance to solder heat

Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.

Then release the device into the room conditions for 4 hours. It shall meet the specifications

in 4.3.

5-3 Solderability

Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than

95% area of the soldering pad must be covered with new solder. It shall meet the

specifications in 4.3.

5-4 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the

filter shall fulfill the specifications in 4.3.

5-5 Vibration

Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude

of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in 4.3.

6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction

of the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the component.

Please avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be soldered. Please avoid soldering another part of

component.