SAW FILTER

HDF930A

S4

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Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high

temperature of +85℃ for 30 Minutes. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall meet the specifications in 3.3.

4-4 Resistance to solder heat

Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for

10±1 sec. Then release the device into the room conditions for 4 hours. The device shall

meet the specifications in 3.3.

4-5 Solderability

Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%

area of the terminals must be covered with new solder. It shall meet the specifications in

3.3.

4-6 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device

shall fulfill the specifications in 3.3.

4-7 Vibration

Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of

1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 3.3.

5. REMARK

5.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of

the component. Please avoid static voltage.

5.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the component. Please

avoid ultrasonic cleaning

5.3 Soldering

Only leads of component may be soldered . Please avoid soldering another part of

component.

6. Packing

6.1 Dimensions

(1) Carrier Tape: Figure 1

(2) Reel: Figure 2

(3) The product shall be packed properly not to be damaged during transportation and storage.

6.2 Reeling Quantity

1000 pcs/reel

7’’

3000 pcs/reel

13’’

6.3 Taping Structure