 2016 Microchip Technology Inc.

DS20005505A-page 13

HV9110/HV9112/HV9113

14-Lead SOIC (Narrow Body) Package Outline (NG)

8.65x3.90mm body, 1.75mm height (max), 1.27mm pitch

Symbol

A

A1

A2

b

D

E

E1

e

h

L

L1

L2

Dimension

(mm)

MIN

1.35*

0.10

1.25

0.31

8.55* 5.80* 3.80*

1.27

BSC

0.25

0.40

1.04

REF

0.25

BSC

NOM

----

8.65

6.00

3.90

-

-

-

-

MAX

1.75

0.25

1.65*

0.51

8.75* 6.20* 4.00*

0.50

1.27

JEDEC Registration MS-012, Variation AB, Issue E, Sept. 2005.

Drawings are not to scale.

D

Seating

Plane

Gauge

Plane

L

L1

L2

Top View

Side View

View A-A

View B

View

B

θ1

θ

E1 E

A A2

A1

A

A

Seating

Plane

e

b

h

h

14

1

Note 1

(Index Area

D/2 x E1/2)

Note 1

Note:

1.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.