100

1

10

0.1

0.01

0.001

0.1

1

10

100

Fault Current (Amps)

Solder Reflow Recommendations

Storage Recommendations

Solder reflow

• Recommended reflow methods: IR, vapor phase oven, hot air oven.

• Devices are not designed to be wave soldered to the bottom side of the

board.

• Gluing the devices is not recommended.

• Recommended maximum paste thickness is 0.25 mm (.010 inch).

• Devices can be cleaned using standard industry methods and solvents.

Note:

• If reflow temperatures exceed the recommended profile, devices may not

meet the performance requirements.

Rework

• A device should not be reworked.

Typical Part Marking

Represents total content. Layout may vary.

MANUFACTURER'S

MARK

PART IDENTIFICATION

030

5A

DATE CODE -

WEEK 1 OF 2005 = 5A

(YEAR & WEEK)

WEEK 27 OF 2005 = A5

(WEEK & YEAR)

remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage recommendations are

exceeded. Devices stored in this manner have an indefinite shelf life.

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)