ADP1763ACPZ-R7 datasheet(6/19 Pages) AD

6 / 19 page

Data Sheet

ADP1763

Rev. 0 | Page 5 of 18

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VIN to GND

−0.3 V to +2.16 V

EN to GND

−0.3 V to +3.96 V

VOUT to GND

−0.3 V to VIN

SENSE to GND

−0.3 V to VIN

VREG to GND

−0.3 V to VIN

REFCAP to GND

−0.3 V to VIN

VADJ to GND

−0.3 V to VIN

SS to GND

−0.3 V to VIN

PG to GND

−0.3 V to +3.96 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Operating Junction Temperature

125°C

Lead Temperature (Soldering, 10 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings apply only individually, not in

combination. The ADP1763 may be damaged when junction

temperature limits are exceeded. Monitoring ambient temperature

does not guarantee that the junction temperature is within the

specified temperature limits. In applications with high power

dissipation and poor thermal resistance, the maximum ambient

temperature may need to be derated.

In applications with moderate power dissipation and low printed

circuit board (PCB) thermal resistance, the maximum ambient

temperature can exceed the maximum limit as long as the junction

temperature is within specification limits. The junction temperature

(TJ) of the device is dependent on the ambient temperature (TA),

the power dissipation of the device (PD), and the junction to

ambient thermal resistance of the package (θJA). TJ is calculated

using the following formula:

TJ = TA + (PD × θJA)

The junction to ambient thermal resistance (θJA) of the package

is based on modeling and a calculation using a 4-layer board.

The junction to ambient thermal resistance is highly dependent

on the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions. The specified

values of θJA are based on a 4-layer, 4 in × 3 in circuit board. For

details about board construction, refer to JEDEC JESD51-7.

ΨJB is the junction to board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

a calculation using a 4-layer board. The JEDEC JESD51-12

document, Guidelines for Reporting and Using Package Thermal

Information, states that thermal characterization parameters are

not the same as thermal resistances. ΨJB measures the component

power flowing through multiple thermal paths rather than a single

path, as in thermal resistance (θJB). Therefore, ΨJB thermal paths

include convection from the top of the package as well as radiation

from the package, factors that make ΨJB more useful in real-world

applications. The maximum junction temperature (TJ) is calculated

from the board temperature (TB) and power dissipation (PD), using

the following formula:

TJ = TB + (PD × ΨJB)

Refer to the JEDEC JESD51-8 and JESD51-12 documents for

more detailed information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance for a 4-Layer 6400 mm2 Copper Size

Package Type

θJA

ΨJB

Unit

16-Lead LFCSP

28.4

°C/W

ESD CAUTION

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