LP3988 datasheet(3/15 Pages) TI1

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LP3988-Q1

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SLAS928A – MARCH 2013 – REVISED JULY 2013

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

Voltage

−0.3

6.5

Power good

VOUT, VEN

−0.3 V to

(VIN + 0.3 V)

Junction temperature

150

°C

Storage Temperature

−65

150

°C

Power dissipation (1)

SOT-23-5

364

Human-body model (HBM) AEC-Q100 Classification Level H2

ESD rating (2)

Charged-device model (CDM) AEC-Q100 Classification Level C4B

750

(1)

The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula: PD = (TJ - TA) /

θJA, where TJ is the junction temperature, TA is the ambient temperature, and θ JA is the junction-to-ambient thermal resistance. The

364-mW rating appearing under Absolute Maximum Ratings for the SOT-23-5 package results from substituting the absolute-maximum

junction temperature, 150°C, for TJ, 70°C for TA, and 175°C/W for θJA. More power can be dissipated safely at ambient temperatures

below 70°C . Less power can be dissipated safely at ambient temperatures above 70°C. The absolute-maximum power dissipation can

be increased by 4.5 mW for each degree below 70°C, and it must be derated by 4.5 mW for each degree above 70°C.

(2)

The human-body model is 100 pF discharged through a 1.5-k

Ω resistor into each pin. The machine model is a 200-pF capacitor

discharged directly into each pin.

Recommended Operating Conditions

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

(2)

2.5

VOUT, VEN

VIN

Operating temperature

−40

125

°C

(1)

All voltages are with respect to the potential at the GND pin.

(2)

The minimum VIN depends on the device output option. For Vout(NOM) < 2.5V, VIN(MIN) will equal 2.5V. For Vout(NOM) ≥ 2.5V, VIN(MIN) will

equal Vout(NOM) + 200mV.

Thermal Information

SOT-23 Package

THERMAL METRIC(1)

UNIT

DBV-5

θJA

Junction-to-ambient thermal resistance

175

°C/W

θJC(top)

Junction-to-case (top) thermal resistance

°C/W

θJB

Junction-to-board thermal resistance

31.9

°C/W

ψJT

Junction-to-top characterization parameter

3.1

°C/W

ψJB

Junction-to-board characterization parameter

31.4

°C/W

θJC(bottom)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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