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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TLE8718SA датащи(PDF) 13 Page - Infineon Technologies AG |
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TLE8718SA датащи(HTML) 13 Page - Infineon Technologies AG |
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13 / 82 page  TLE 8718 SA General Product Characteristics Data Sheet 13 Rev. 1.1, 2012-07-31 4.3 Thermal Resistance Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Figure 5 Thermal simulation - PCB setup Table 4 Thermal Resistance T j = -40°C to +150°C, all voltages with respect to PGND, positive current flowing into pin, unless otherwise specified Pos. Parameter Symbol Values Unit TC Conditions min. typ. max. 4.3.1 Junction to Case R thJC –– 2 K/W C 1) 1) Power dissipation Pv=3W distributed statically and homogeneously over all power stages. Resistive Load. 4.3.2 Junction to Ambient R thJA –25 – K/W C see Figure 5 1) 70µm modeled (traces) 35µm, 90% metalization 35µm, 90% metalization 70µm, 5% metalization Dimensions : 76.2 x 114.3 x 1.6 mm³; Material: FR4 Thermal Vias: diameter = 0.3 mm; plating 25 µm; 56 pcs. Metalization accodring : JEDEC 2s2p (JESD 51-7) + (JESD 51-5) Thermal_Setup .vsd |
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