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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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RN1723 датащи(PDF) 8 Page - Microchip Technology |
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RN1723 датащи(HTML) 8 Page - Microchip Technology |
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8 / 32 page  RN1723 DS70005224A-page 8 2015 Microchip Technology Inc. 1.4 Soldering Recommendations The RN1723 wireless module was assembled using the IPC/JEDEC J-STD-020 Standard lead-free reflow profile. However, the RN1723 module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging the module, it is recommended to adhere to the following: • Solder reflow recommendations are provided in the Microchip application note, AN233 “Solder Reflow Recommendation” (DS00233) • Do not exceed a peak temperature (TP) of 250°C • Refer to the vendor’s solder paste data sheet for specific reflow profile recommendations • Use no-clean flux solder paste • Do not wash, as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. |
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