TPS61070 datasheet(18/21 Pages) TI

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0.1 µF

DS1

1 µF

VCC2 ~−VCC

Unregulated

AuxiliaryOutput

Power

Supply

VBAT

VOUT

GND

TPS6107x

ListofComponents:

U1= TPS61070DDC

L1= 4.7µHWurthElektronik744031004

C1=2x4.7 µF,0603,X7R/X5RCeramic

C2=2x4.7 µF,0603,X7R/X5RCeramic

VCC

BoostOutput

THERMAL INFORMATION

D(MAX)

J(MAX)

* T

+ 125°C * 85°C

130

°C W

+ 308 mW

(8)

TPS61070, TPS61071

TPS61072, TPS61073

SLVS510A – JULY 2006 – REVISED JANUARY 2007

Figure 28. Power Supply Solution With Auxiliary Negative Output Voltage

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the

power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance follow.

• Improving the power dissipation capability of the PCB design

• Improving the thermal coupling of the component to the PCB

• Introducing airflow in the system

The maximum recommended junction temperature (TJ) of the TPS6107x devices is 125°C. The thermal

resistance of the 6-pin thin SOT package (DDC) is RΘJA = 130°C/W. Specified regulator operation is assured to

a maximum ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 308 mW. More

power can be dissipated if the maximum ambient temperature of the application is lower.

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