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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MRF24WN0MA датащи(PDF) 10 Page - Microchip Technology |
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MRF24WN0MA датащи(HTML) 10 Page - Microchip Technology |
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10 / 36 page  MRF24WN0MA/MB DS50002410A-page 10 Advance Information 2015 Microchip Technology Inc. FIGURE 1-7: MRF24WN0MA/MB HOST PCB EXAMPLE LAYOUT 1.3 Soldering Recommendations The MRF24WN0MA/MB wireless module was assem- bled using the IPC/JEDEC J-STD-020 Standard lead- free reflow profile. The MRF24WN0MA/MB module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging the module, adhere to the following recommendations: • Solder reflow recommendations are provided in the Microchip Application Note, AN233 "Solder Reflow Recommendation" (DS00233) • Do not exceed a peak temperature (TP) of 250°C • Refer to the solder paste data sheet for specific reflow profile recommendations from the vendor • Use no-clean flux solder paste • Do not wash as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. Best Okay Okay Okay No Copper in these Areas |
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