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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AS2533F датащи(PDF) 24 Page - ams AG |
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AS2533F датащи(HTML) 24 Page - ams AG |
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24 / 26 page  Data She et AS25 33-36 austriamicrosystems Revision 8.10 Page 23 of 25 Conditions for Delivery as Dice on Foil, sawn Die thickness 380 ± 20 m Back finishing back grinding, silicon Frame Material: Plastic Size: see figure Frame Position Tolerance Center wafer to frame: ± 4mm Angle deviation wafer to frame: ± 8° Orientation wafer to frame: Wafer flat to frame side with kerfs Covering adhesive foil to frame: >5mm Tape Type: PVC with acrylic adhesive Thickness: 70 ± 20 m Sawing conditions Sawing mode: Saw - through mode Sawing width: typ. 60 m Kerf depth in foil: typ. 20 m XV -dimension deviation: max.25 m Packing frame sealed in foil bags filled with nitrogen Storage time In sealed bags 2 months, Tamb = 25 °C Mechanical Drawing of Frame (valid for 200 mm and 150 mm wafer) |
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