SP37E760 datasheet(76/78 Pages) SMSC

номер детали	SP37E760

подробное описание детали	3.3 V I/O CONTROLLER FOR EMBEDDED APPLICATIONS

PDF	78 Pages

Scroll/Zoom	100%

производитель	SMSC [SMSC Corporation]

домашняя страница	http://www.smsc.com

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76 / 78 page

SMSC DS – SP37E760

Page 76

Rev. 04/13/2001

10 PACKAGE OUTLINES

FIGURE 17 – 100 PIN QFP

0.1

C-

TD /

Notes :

1) C oplanarity is 0.100mm (.004") max imum.

2) Toleranc e on the pos ition of the leads is

0.200mm (.008") max imum.

3) Pac k age body dimens ions D 1 and E1 do not

inc lude the mold protrus ion. Max imum mold

protrus ion is 0.25mm (.010").

4) D imens ions TD and TE are important for tes ting

by robotic handler. Only abov e c ombinations of (1)

or (2) are ac c eptable.

5) C ontrolling dimens ion: millimeter. D imens ions

in inc hes for referenc e only and not

necess arily

ac c urate.

DIM

TD (1

)

TE(1)

TD (2

)

TE(2)

MIN

2.80

0.1

2.57

23.4

19.9

17.4

13.9

0.1

0.65

1.8

MA X

3.15

0.45

2.87

24.15

20.1

18.15

14.1

0.2

0.95

2.6

MIN

.110

.004

.101

.921

.783

.685

.547

.004

.026

.071

MA X

.124

.018

.113

.951

.791

.715

.555

.008

.037

.102

0°

21.8

15.8

22.21

16.27

12°

22.2

16.2

22.76

16.82

0.65 BSC

0°

.008

.858

.622

.874

.641

12°

.016

.874

.638

.896

.662

.0256 BSC

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