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AL5802LP4 датащи(PDF) 4 Page - Diodes Incorporated |
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AL5802LP4 датащи(HTML) 4 Page - Diodes Incorporated |
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4 / 10 page ![]() AL5802LP4 Document number: DS37441 Rev. 4 - 2 4 of 10 www.diodes.com February 2016 © Diodes Incorporated AL5802LP4 Electrical Characteristics: NPN Transistor – Q1 (@T A = +25°C, unless otherwise specified.) Symbol Characteristic Test Condition Min Typ Max Unit V(BR)CEO Collector-Emitter Breakdown Voltage (Note 6) (Note 7) IC = 1.0mA, IB = 0 40 — — V V(BR)EBO Emitter-Base Breakdown Voltage IE = 10µA, IC = 0 6.0 — — V ICEX Collector Cutoff Current (Note 7) VCE = 30V, VEB(OFF) = 3.0V — — 50 nA IBL Base Cutoff Current (Note 7) VCE = 30V, VEB(OFF) = 3.0V — — 50 nA hFE DC Current Gain IC = 1.0mA, VCE = 1.0V IC = 10mA, VCE = 1.0V 70 100 — — — 300 — VCE(SAT) Collector-Emitter Saturation Voltage (Note 6) IC = 10mA, IB = 1.0mA — — 0.20 V VBE(SAT) Base-Emitter Saturation Voltage IC = 10mA, IB = 1.0mA 0.65 — 0.85 V VBE(ON) Base-Emitter Turn-On Voltage VCE = 1.20V, IC = 2.0mA 0.30 1.10 V Electrical Characteristics: NPN Pre-biased Transistor – Q2 (@T A = +25°C, unless otherwise specified.) Symbol Characteristic Test Condition Min Typ Max Unit V(BR)CBO Collector-Base Breakdown Voltage IC = 50μA, IE = 0 30 — — V V(BR)CEO Collector-Emitter Breakdown Voltage (Note 6) IC = 1mA, IB = 0 30 — — V V(BR)EBO Emitter-Base Breakdown Voltage (Note 7) IE = 50μA, IC = 0 5.0 — — V ICBO Collector Cutoff Current VCB = 30V, IE = 0 — — 0.5 µA IEBO Emitter Cutoff Current (Note 7) VEB = 4V, IC = 0 — — 0.5 µA VCE(SAT) Collector-Emitter Saturation Voltage (Note 6) IC = 10mA, IB = 1mA — — 0.3 V VBE(ON) Base-Emitter Turn-On Voltage VCE = 5.0V, IC = 2.0mA 0.30 1.10 V hFE DC Current Gain (Note 6) VCE = 5V, IC = 150mA 100 — — — R1 Input Resistance — 7 10 13 kΩ *Characteristics of transistor only. Notes: 6. Short duration pulse test used to minimize self-heating effect. 7. Guaranteed by design and tested only at the wafer level for single die. These parameters cannot be tested at the finished good level due to test conditions changed after packaging multi-dies to form an application circuit. |
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