PCF8831 datasheet(21/28 Pages) PHILIPS

21 / 28 page

2002 Aug 14

Philips Semiconductors

Preliminary speciﬁcation

STN RGB - 160 output row driver

PCF8831

Table 4

Bonding pad dimensions

242

−3463.5

+865.7

Dummy

243

−3728.5

+865.7

Dummy

244

−3803.5

+865.7

Dummy

245

−3878.5

+865.7

Dummy

246

−3953.5

+865.7

Dummy

247

−4103.5

+865.7

Dummy

248

−4178.5

+865.7

Dummy

249

−4253.5

+865.7

Dummy

250

−4328.5

+865.7

Dummy

251

−4403.5

+865.7

Dummy

252

−4478.5

+865.7

Dummy

253

−4553.5

+865.7

Dummy

254

−4628.5

+865.7

Dummy

255

−4703.5

+865.7

Dummy

256

−4778.5

+865.7

Dummy

257

−4853.5

+865.7

Dummy

258

−4928.5

+865.7

Dummy

259

−5003.5

+865.7

Dummy

260

−5078.5

+865.7

Dummy

261

−5153.5

+865.7

Dummy

262

−5228.5

+865.7

SYMBOL

PAD

Dummy

263

−5303.5

+865.7

Dummy

264

−5378.5

+865.7

Dummy

265

−5453.5

+865.7

Dummy

266

−5528.5

+865.7

Dummy

267

−5603.5

+865.7

Dummy

268

−5678.5

+865.7

Dummy

269

−5753.5

+865.7

Dummy

270

−5978.5

+865.7

Dummy

271

−6053.5

+865.7

Dummy

272

−6128.5

+865.7

Alignment marks (see Fig.12)

Alignment circle 1

5909.0

865.7

Alignment circle 2

−5866.0

+865.7

PAD

SIZE

UNIT

Minimum pad pitch

µm

Pad size; aluminium

tbf

µm

Bump dimensions

× 80 × 17.5 (±5)

µm

Wafer thickness

(excluding bumps)

381

µm

SYMBOL

PAD

handbook, halfpage

MGW640

12.66 mm

pitch

2.36

PCF8831

Fig.11 Bonding pads.

MGS688

handbook, halfpage

x centre

y centre

100

µm

Fig.12 Alignment mark detail.

PCF8831 датащи(PDF) 21 Page - NXP Semiconductors

PCF8831 датащи(HTML) 21 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

датащи скачать

ссылки URL