Major Ratings and Characteristics

Parameters

IRK.91

Units

I

F(AV)

100

A

@ T

C

100

°C

157

A

I

FSM

@ 50Hz

2020

A

@ 60Hz

2110

A

I

@ 50Hz

20.43

KA

@ 60Hz

18.65

KA

I

204.3

KA

V

RRM

range

400 to 1600

V

T

J

- 40 to 150

- 40 to150

100 A

STANDARD DIODES

IRK.91 SERIES

Bulletin I27141 rev. F 10/02

1

www.irf.com

Features

High Voltage

Industrial Standard Package

Thick Al metal die and double stick bonding

Thick copper baseplate

UL E78996 approved

3500V

Benefits

Up to 1600V

Full compatible TO-240AA

High Surge capability

Easy Mounting on heatsink

Al

Heatsink grounded

Mechanical Description

The Generation V of Add-A-pak module combine the

excellent thermal performance obtained by the usage

of Direct Bonded Copper substrate with superior

mechanical ruggedness, thanks to the insertion of a

solid Copper baseplate at the bottom side of the device.

The Cu baseplate allow an easier mounting on the

majority of heatsink with increased tolerance of surface

roughness and improve thermal spread.

The Generation V of AAP module is manufactured

without hard mold, eliminating in this way any possible

direct stress on the leads.

Electrical Description

These modules are intended for general purpose high

voltage applications such as high voltage regulated power

supplies, lighting circuits, temperature and motor speed

control circuits, UPS and battery charger.

The electrical terminals are secured against axial pull-out:

they are fixed to the module housing via a click-stop

feature already tested and proved as reliable on other IR

modules.