THS4500

THS4501

SLOS350D − APRIL 2002 − REVISED JANUARY 2004

www.ti.com

2

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNIT

16.5 V

150 mA

4 V

Continuous power dissipation

See Dissipation Rating Table

150

°C

Maximum junction temperature, continuous

125

°C

Operating free-air temperature

C suffix

0

°C to 70°C

Operating free-air temperature

I suffix

−40

°C to 85°C

−65

°C to 150°C

Lead temperature

1,6 mm (1/16 inch) from case for 10 seconds

300

°C

HBM

4000 V

ESD ratings:

CDM

2000 V

ESD ratings:

MM

100 V

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

 on the underside

of the chip. This acts as a heat sink and must be connected to a

thermally dissipative plane for proper power dissipation. Failure

to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI

technical briefs SLMA002 and SLMA004 for more information

about utilizing the PowerPAD thermally enhanced package.

limited by the constraints of the silicon process.

limited by package constraints. Operation above this temperature

may result in reduced reliability and/or lifetime of the device.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PACKAGE DISSIPATION RATINGS

PACKAGE

θJC

θJA(1)

POWER RATING(2)

PACKAGE

θJC

(

°C/W)

θJA(1)

(

°C/W)

TA ≤ 25°C

TA = 85°C

D (8 pin)

38.3

97.5

1.02 W

410 mW

DGN (8 pin)

4.7

58.4

1.71 W

685 mW

DGK (8 pin)

54.2

260

385 mW

154 mW

(1) This data was taken using the JEDEC standard High-K test PCB.

(2) Power rating is determined with a junction temperature of 125°C.

This is the point where distortion starts to substantially increase.

Thermal management of the final PCB should strive to keep the

junction temperature at or below 125

°C for best performance and

long term reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Supply voltage

Dual supply

±5

±7.5

V

Supply voltage

Single supply

4.5

5

15

V

Operating free-

air temperature,

C suffix

0

70

°C

air temperature,

I suffix

−40

85

°C

PACKAGE/ORDERING INFORMATION

ORDERABLE PACKAGE AND NUMBER

TEMPERATURE

PLASTIC

SMALL OUTLINE

PLASTIC MSOP(1)

PowerPad

PLASTIC MSOP(1)

SMALL OUTLINE

(D)

(DGN)

SYMBOL

(DGK)

SYMBOL

0

°C to 70°C

THS4500CD

THS4500CDGN

BFB

THS4500CDGK

ATV

0

°C to 70°C

THS4501CD

THS4501CDGN

BFD

THS4501CDGK

ATW

−40

°C to 85°C

THS4500ID

THS4500IDGN

BFC

THS4500IDGK

ASV

−40

°C to 85°C

THS4501ID

THS4501IDGN

BFE

THS4501IDGK

ASW

(1) All packages are available taped and reeled. The R suffix standard quantity is 2500. The T suffix standard quantity is 250 (e.g., THS4501DT).