THS3202

SLOS242D − SEPTEMBER 2002 − REVISED JANUARY 2004

www.ti.com

2

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNIT

16.5 V

175 mA

Continuous power dissipation

See Dissipation Rating Table

150

°C

Maximum junction temperature, continuous

125

°C

−40

°C to 85°C

−65

°C to 150°C

Lead temperature

1,6 mm (1/16 inch) from case for 10 seconds

300

°C

HBM

3000 V

ESD ratings:

CDM

1500 V

ESD ratings:

MM

200 V

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

 on the underside

of the chip. This acts as a heat sink and must be connected to a

thermally dissipative plane for proper power dissipation. Failure

to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI

technical briefs SLMA002 and SLMA004 for more information

about utilizing the PowerPAD thermally enhanced package.

limited by the constraints of the silicon process.

limited by package constraints. Operation above this temperature

may result in reduced reliability and/or lifetime of the device.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PACKAGE DISSIPATION RATINGS

PACKAGE

θJC

θJA(1)

POWER RATING(2)

PACKAGE

θJC

(

°C/W)

θJA(1)

(

°C/W)

TA ≤ 25°C

TA = 85°C

D (8 pin)

38.3

97.5

1.32 W

410 mW

DGN (8 pin)

4.7

58.4

1.71 W

685 mW

DGK (8 pin)

54.2

260

385 mW

154 mW

(1) This data was taken using the JEDEC standard High-K test PCB.

(2) Power rating is determined with a junction temperature of 125°C.

This is the point where distortion starts to substantially increase.

Thermal management of the final PCB should strive to keep the

junction temperature at or below 125

°C for best performance and

long term reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Supply voltage,

Dual supply

±3.3

±7.5

V

Supply voltage,

(VS+ and VS−)

Single supply

6.6

15

V

Operating free-air temperature

range

−40

85

°C

PACKAGE/ORDERING INFORMATION

ORDERABLE PACKAGE AND NUMBER

NUMBER OF

CHANNELS

PLASTIC SOIC-8(1)

(D)

PLASTIC MSOP-8(1)

PowerPAD

PLASTIC MSOP-8(1)

CHANNELS

(D)

(DGN)

SYM

(DGK)

SYM

2

THS3202D

THS3202DGN

BEP

THS3202DGK

BEV

(1) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., THS3202DR).

PIN ASSIGNMENTS

1

2

3

4

8

7

6

5

D, DGN, DGK

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