2004 Jan 27

27

Philips Semiconductors

Preliminary specification

High efficiency 2

× 25 W/4 Ω

stereo car radio power amplifier

TDA1564

applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250

°C or 265 °C, depending on solder material

applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron

applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300

°C. When using a dedicated

tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320

°C.

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

“(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

4. Hot bar soldering or manual soldering is suitable for PMFP packages.

5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature

exceeding 217

°C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

7. If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

MOUNTING

PACKAGE(1)

SOLDERING METHOD

WAVE

REFLOW(2) DIPPING

Through-hole mount CPGA, HCPGA

suitable

−

suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable(3)

−−

Through-hole-

surface mount

PMFP(4)

not suitable

not suitable

−

Surface mount

BGA, HTSSON..T(5), LBGA, LFBGA, SQFP,

SSOP-T(5), TFBGA, USON, VFBGA

not suitable

suitable

−

DHVQFN, HBCC, HBGA, HLQFP, HSO,

HSOP, HSQFP, HSSON, HTQFP, HTSSOP,

HVQFN, HVSON, SMS

not suitable(6)

suitable

−

PLCC(7), SO, SOJ

suitable

suitable

−

LQFP, QFP, TQFP

not recommended(7)(8) suitable

−

SSOP, TSSOP, VSO, VSSOP

not recommended(9)

suitable

−

CWQCCN..L(11), PMFP(10), WQCCN32L(11)

not suitable

not suitable

−