ELECTROSTATIC DISCHARGE (ESD) PROTECTION

PACKAGE DISSIPATION RATINGS

(1) (2) (3)

TPS55383

,, TPS55386

MIN

UNIT

Human body model

2k

CDM

1.5k

V

Machine Model

250

THERMAL IMPEDANCE

JUNCTION-TO-THERMAL

PACKAGE

PAD (°C/W)

POWER RATING (W)

POWER RATING (W)

Plastic 16-Pin HTSSOP (PWP)

1.6

1.0

(1)

For more information on the PWP package, refer to TI Technical Brief (SLMA002A).

(2)

TI device packages are modeled and tested for thermal performance using printed circuit board designs outlined in JEDEC standards

JESD 51-3 and JESD 51-7.

(3)

For application information, see the Power Derating section.

(4)

Copyright © 2008, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Link(s): TPS55383 TPS55386