OPA347SASLASH3K datasheet(11/21 Pages) TI

11 / 21 page

OPA347, 2347, 4347

SBOS167C

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OPA2347 WCSP PACKAGE

The OPA2347YED is a die-level package using bump-on-pad

technology. Unlike plastic packages, the OPA2347YED has no

molding compound, lead frame, wire bonds, or leads. Using

standard surface-mount assembly procedures, the WCSP can

be mounted to a printed circuit board without additional under

fill. Figures 10 and 11 detail pinout and package marking.

FIGURE 10. Pin Description.

PACKAGE DIMENSIONS

The OPA2347YED is transported in tape and reel media and

is described in Table I and Figure 12. Pin 1 orientation is

consistent throughout the tape and reel carrier, with balls

facing down in each pocket of the carrier tape. The location

of Pin 1 is specified in Figure 12.

FIGURE 11. Top View Package Marking.

V+

Out B

–In B

+In B

Out A

–In A

+In A

V–

OPA2347

(bump side down)

Not to Scale

WCSP-8

(top view)

OPA2347YED

Top View

(bump side down)

Actual Size:

Package Marking Code:

YMD = year/month/day

CC = indicates OPA2347

S = for engineering purposes only

Exact Size:

1.008mm x 2.100mm

TEST

CONDITION

ACCEPT CRITERIA (ACTUAL)

SAMPLE SIZE

Temperature Cycle

–40

°C to 125°C, 1 Cycle/hr, 15 Minute Ramp(1)

10 Minute Dwell

500 (1600) Cycles, R < 1.2X from R0

Drop

50cm

10 (129) Drops, R < 1.2X from R0

Key Push

100 Cycles/min,

5K (6.23K) Cycles, R < 1.2X from R0

1300

µε, Displacement = 2.7mm Max

3 Point Bend

Strain Rate 5 mm/min, 85 mm Span

R < 1.2X from R0

NOTE: (1) Per IPC9701.

TABLE II. Reliability Test Results.

PHOTOSENSITIVITY

Although the OPA2347YED package has a protective back-

side coating that reduces the amount of light exposure on the

die, unless fully shielded, ambient light will still reach the

active region of the device. Input bias current for the

OPA2347YED package is specified in the absence of light.

Depending on the amount of light exposure in a given

application, an increase in bias current, and possible in-

creases in offset voltage should be expected. In circuit board

tests under ambient light conditions, a typical increase in bias

current reached 100pA. Flourescent lighting may introduce

noise or hum due to their time varying light output. Best

practice should include end-product packaging that provides

shielding from possible light souces during operation.

DIMENSIONS (mm)

OPA2347YED

Pocket Width, A0

1.12

± 0.10

Pocket Length, B0

2.13

± 0.10

Pocket Depth, K0

0.61

± 0.10

Pocket Pitch, P1

4.00

± 0.10

Sprocket Hole-to-Pocket Centerline, F

3.50

± 0.05

Sprocket Hole-to-Pocket Offset, P2

2.00

± 0.05

Sprocket Hole Pitch, P0

4.00

± 0.10

Tape Width, W

8.00

± 0.30

Reel Diameter, Max

TBD

TABLE I. Carrier Tape Dimensions.

FIGURE 12. Tape and Reel Carrier Tape Diagram.

+++

0.229

1.50

± 0.10

1.75

± 0.10

Pin 1(1)

Section Y – Y

Dimensions in mm

NOTE: (1) Pin 1 location is

in the upper left-hand corner

of the cavity. Units are shipped

with bumps down.

LAND PATTERNS AND ASSEMBLY

The recommended land pattern for the OPA2347YED package

is detailed in Figure 13 with specifications listed in Table III.

The maximum amount of force during assembly should be

limited to 30 grams of force per bump.

RELIABILITY TESTING

To ensure reliability, the OPA2347YED has been verified to

successfully pass a series of reliability stress tests. A sum-

mary of JEDEC standard reliability tests is shown in Table II.

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