Digital Output and Low-Resistance Current Conductor

ACS764

21

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Package LF, 24-Pin QSOP

0.635 BSC

0.25

0.15

0.25 MAX

1.75 MAX

8º

0º

1.27

0.41

0.25 BSC

1.04 REF

8.66 ±0.10

3.91 ±0.10

0.30

0.20

5.99 ±0.20

C

0.20

24X

SEATING

PLANE

C

0.635

2.30

5.00

0.40

2

1

24

GAUGE PLANE

SEATING PLANE

A

C

C

B

A

For Reference Only, not for tooling use (reference JEDEC MO-137 AE)

Dimensions in millimeters

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

B

Reference pad layout (reference IPC7351 SOP63P600X175-24M)

All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary

to meet application process requirements and PCB layout tolerances

Terminal #1 mark area

PCB Layout Reference View

Standard Branding Reference View

N = Device part number

T = Temperature code

LF = (Literal) Package type

A = Amperage

TLF-AAA

LLLLLLLLLLL

NNNNNNNNNNNNN

Branded Face

Branding scale and appearance at supplier discretion