High Accuracy, Hall-effect Based Current Sensor

IC in High Isolation SOIC16 Package

ACS723KMA

16

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Figure 8: Package MA, 16-pin SOICW

PACKAGE OUTLINE DRAWING

For Reference Only – Not for Tooling Use

(Reference MS-013AA)

NOT TO SCALE

Dimensions in millimeters

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

C

1.27 BSC

A

B

C

B

2

1

1

16

Branding scale and appearance at supplier discretion

C

SEATING

PLANE

C

0.10

16X

0.25 BSC

1.40 REF

2.65 MAX

10.30 ±0.20

7.50 ±0.10

10.30 ±0.33

0.51

0.31

0.30

0.10

0.33

0.20

1.27

0.40

8°

0°

A

Standard Branding Reference View

Branded Face

SEATING PLANE

GAUGE PLANE

NNNNNNNNNNNN

YYWW

LLLLLLLLLLLL

= Device part number

= Supplier emblem

= Last two digits of year of manufacture

= Week of manufacture

= Lot number

N

Y

W

L

Terminal #1 mark area

C

2

1

16

0.65

1.27

9.50

2.25

PCB Layout Reference View

Reference land pattern layout (reference IPC7351 SOIC127P600X175-8M);

all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary

to meet application process requirements and PCB layout tolerances