8

ISO7821, ISO7821F

SLLSEM2F – NOVEMBER 2014 – REVISED MARCH 2016

www.ti.com

Product Folder Links: ISO7821 ISO7821F

Submit Documentation Feedback

Copyright © 2014–2016, Texas Instruments Incorporated

(1)

For more information about trdational and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

ISO7821

UNIT

DW (SOIC)

DWW (SOIC)

16 PINS

16-PINS

Junction-to-ambient thermal resistance

84.7

84.7

°C/W

Junction-to-case(top) thermal resistance

47.3

46.0

°C/W

Junction-to-board thermal resistance

49.4

54.5

°C/W

Junction-to-top characterization parameter

19.1

18.5

°C/W

Junction-to-board characterization parameter

48.8

53.8

°C/W

Junction-to-case(bottom) thermal resistance

n/a

n/a

°C/W

6.5 Power Dissipation Characteristics

VALUE

UNIT

Maximum power dissipation by ISO7821x

square wave

100

mW

Maximum power dissipation by side-1 of

ISO7821x

50

Maximum power dissipation by side-2 of

ISO7821x

50