MCP1700_13 datasheet(13/28 Pages) MICROCHIP

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DS20001826C-page 13

MCP1700

6.0

APPLICATION CIRCUITS AND

ISSUES

6.1

Typical Application

The MCP1700 is most commonly used as a voltage

regulator. Its low quiescent current and low dropout

voltage make it ideal for many battery-powered

applications.

FIGURE 6-1:

Typical Application Circuit.

6.1.1

APPLICATION INPUT CONDITIONS

6.2

Power Calculations

6.2.1

POWER DISSIPATION

The internal power dissipation of the MCP1700 is a

function of input voltage, output voltage and output

current. The power dissipation resulting from the

quiescent current draw is so low it is insignificant

(1.6 µA x VIN). The following equation can be used to

calculate the internal power dissipation of the LDO.

EQUATION 6-1:

The

maximum

continuous

operating

junction

temperature specified for the MCP1700 is +125°C. To

estimate the internal junction temperature of the

MCP1700, the total internal power dissipation is

multiplied by the thermal resistance from junction to

ambient (R



JA). The thermal resistance from junction to

ambient for the SOT-23 pin package is estimated at

230°C/W.

EQUATION 6-2:

The maximum power dissipation capability for a

package can be calculated given the junction-to-

ambient thermal resistance and the maximum ambient

temperature for the application. The following equation

can be used to determine the maximum internal power

dissipation of the package.

EQUATION 6-3:

EQUATION 6-4:

Package Type = SOT-23

Input Voltage Range = 2.3V to 3.2V

VIN maximum = 3.2V

VOUT typical = 1.8V

IOUT = 150 mA maximum

GND

VOUT

VIN

CIN

1µF Ceramic

COUT

1µF Ceramic

VOUT

VIN

(2.3V to 3.2V)

1.8V

IOUT

150 mA

MCP1700

LDO

IN MAX



OUT MIN



–

 I

OUT MAX





PLDO = Internal power dissipation of the

LDO Pass device

VIN(MAX) = Maximum input voltage

VOUT(MIN) = Minimum output voltage of the

LDO

JMAX



TOTAL





AMAX



TJ(MAX) =

Maximum continuous junction

temperature

PTOTAL =

Total power dissipation of the device



JA =

Thermal resistance from junction to

ambient

TA(MAX) =

Maximum ambient temperature

DMAX



JMAX



AMAX



–





---------------------------------------------------

PD(MAX) =

Maximum power dissipation of the

device

TJ(MAX) =

Maximum continuous junction

temperature

TA(MAX) =

Maximum ambient temperature



JA =

Thermal resistance from junction to

ambient

JRISE



DMAX







TJ(RISE) = Rise in the device’s junction

temperature over the ambient

temperature

PTOTAL = Maximum power dissipation of the

device



JA =

Thermal resistance from junction to

ambient

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