2004 July 12

16

Philips Semiconductors

Product specification

IC card interface

TDA8024

9

LIMITING VALUES

Notes

1. All card contacts are protected against any short-circuit with any other card contact.

2. Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.

Method 3015 (HBM; 1500

Ω and 100 pF) 3 pulses positive and 3 pulses negative on each pin referenced to ground.

3. In accordance with EIA/JESD22-A114-B, June 2000.

4. In accordance with EIA/JESD22-A115-A, October 1997.

10 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However it is good practice to take

normal precautions appropriate to handling MOS devices (see

“Handling MOS devices”).

11 THERMAL CHARACTERISTICS

Note

1. This figure was obtained using the following PCB technology: FR, 4 layers, 0.5 mm thickness, class 5, copper

thickness 35

µm, Ni/Go plating, ground plane in internal layers

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

−0.3

+6.5

V

DC/DC converter supply voltage

−0.3

+6.5

V

voltage on input and output pins

pins XTAL1, XTAL2, 5V/3V, RSTIN,

AUX1UC, AUX2UC, I/OUC,

CLKDIV1, CLKDIV2, CMDVCC, OFF

and PORADJ

−0.3

+6.5

V

voltage on card pins

pins PRES, PRES, I/O, RST, AUX1,

AUX2 and CLK

−0.3

+6.5

V

voltage on other pins

−0.3

+6.5

V

maximum junction temperature

−

150

°C

storage temperature

−55

+150

°C

electrostatic discharge voltage

card contacts in typical application;

notes 1 and 2

CLK, PRES and PRES

−6+6

kV

all pins; note 1

human body model; notes 2 and 3

−2+2

kV

machine model; note 4

−200

+200

V

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction

to ambient

in free air

TDA8024T

70

K/W

TDA8024AT

70

K/W

TDA8024TT

100(1)

K/W