LP5560TMXSLASHNOPB datasheet(4/29 Pages) TI1

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LP5560

SNVS873D – AUGUST 2012 – REVISED JUNE 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications. Voltage

(4)

Undervoltage lockout (UVLO) shuts down the LED driver with VIN drops to 2.3 V (typical). Power-on reset (POR) trips at VIN = 2 V

(typical).

(5)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typical) and

disengages at TJ=140°C (typical).

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Voltage on VDD pin

−0.3

Voltage on other pins (CTRL,LED)(4)

−0.3

VDD + 0.3 V with

6 V maximum

Continuous power dissipation(5)

Internally Limited

Junction temperature, TJ-MAX

125

°C

Storage temperature, Tstg

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

(2)

All voltages are with respect to the potential at the GND pin.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

Voltage on power pin (VDD)

2.7

5.5

Junction temperature, TJ

−30

125

°C

Ambient temperature, TA

(1)

−30

°C

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