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LP3991TL-1.7/NOPB датащи(PDF) 13 Page - Texas Instruments |
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LP3991TL-1.7/NOPB датащи(HTML) 13 Page - Texas Instruments |
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13 / 26 page ![]() 0 1.0 2.0 3.0 4.0 5.0 DC BIAS (V) 0402, 6.3V, X5R 0603, 10V, X5R 100 80 60 40 20 13 LP3991 www.ti.com SNVS296J – DECEMBER 2006 – REVISED JUNE 2016 Product Folder Links: LP3991 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Figure 13. Effect of DC Bias on Capacitance Value As an example Figure 13 shows a typical graph showing a comparison of capacitor case sizes in a capacitance vs. DC Bias plot. As shown in Figure 13, as a result of the DC Bias condition, the capacitance value may drop below the minimum capacitance value given in the recommended capacitor table. Note that Figure 13 shows the capacitance out of spec for the 0402 case size capacitor at higher bias voltages. TI therefore recommends that the capacitor manufacturers' specifications for the nominal value capacitor are consulted for all conditions as some capacitor sizes (for example, 0402) may not be suitable in the actual application. Ceramic capacitors have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a typical 4.7-µF ceramic capacitor is in the range of 20 m Ω to 40 mΩ, which easily meets the ESR requirement for stability for the LP3991. The temperature performance of ceramic capacitors varies by type. Capacitor type X7R is specified with a tolerance of ±15% over the temperature range –55°C to +125°C. The X5R has a similar tolerance over the reduced temperature range of –55°C to +85°C. Some large value ceramic capacitors (4.7 µF) are manufactured with Z5U or Y5V temperature characteristics, which can result in the capacitance dropping by more than 50% as the temperature varies from 25°C to +85°C. Therefore, X7R or X5R types are recommended in applications where the temperature changes significantly above or below 25°C. Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance and voltage ratings in the 1-µF to 4.7-µF range. Another important consideration is that tantalum capacitors have higher ESR values than equivalent size ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the same ESR value. The ESR of a typical tantalum increases about 2:1 as the temperature goes from 25°C down to –40°C, so some guard band must be allowed. 8.2.2.6 Power Dissipation Knowing the device power dissipation and proper sizing of the thermal plane connected to the tab or pad is critical to ensuring reliable operation. Device power dissipation depends on input voltage, output voltage, and load conditions and can be calculated with Equation 1. PD(MAX) = (VIN(MAX) – VOUT) × IOUT (1) Power dissipation can be minimized, and greater efficiency can be achieved, by using the lowest available voltage drop option that would still be greater than the dropout voltage (VDO). However, keep in mind that higher voltage drops result in better dynamic (that is, PSRR and transient) performance. On the LP3991 DSBGA (YZR) package, the primary conduction path for heat is through the four bumps to the PCB. The maximum allowable junction temperature (TJ(MAX)) determines maximum power dissipation allowed (PD(MAX)) for the device package. Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance (RθJA) of the combined PCB and device package and the temperature of the ambient air (TA), according to Equation 2 or Equation 3: TJ(MAX) = TA(MAX) + ( RθJA × PD(MAX)) (2) PD(MAX) = (TJ(MAX) – TA(MAX)) / RθJA (3) |
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