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LP3907

SNVS511S – JUNE 2007 – REVISED APRIL 2016

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Copyright © 2007–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Tables................................... 3

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 6

7.1

Absolute Maximum Ratings ...................................... 6

7.2

ESD Ratings.............................................................. 6

7.3

Recommended Operating Conditions (Bucks).......... 6

7.4

Thermal Information .................................................. 7

7.5

General Electrical Characteristics............................ 7

7.6

Low Dropout Regulators, LDO1 And LDO2............. 8

7.7

Buck Converters SW1, SW2.................................... 8

7.8

I/O Electrical Characteristics.................................... 9

7.9

Power-On Reset (POR) Threshold/Function .......... 9

7.10

7.11

Typical Characteristics — LDO............................. 10

7.12

Typical Characteristics — Bucks .......................... 12

7.13

Typical Characteristics — Buck1 .......................... 13

7.14

Typical Characteristics — Buck2 .......................... 14

7.15

Typical Characteristics — Bucks .......................... 15

8

Detailed Description ............................................ 17

8.1

Overview ................................................................. 17

8.2

Functional Block Diagram ....................................... 17

8.3

Feature Description................................................. 18

8.4

Device Functional Modes........................................ 26

8.5

Programming .......................................................... 27

8.6

Register Maps ........................................................ 30

9

Application and Implementation ........................ 40

9.1

Application Information............................................ 40

9.2

Typical Application ................................................. 40

10

Power Supply Recommendations ..................... 46

10.1

Analog Power Signal Routing ............................... 46

11

Layout................................................................... 47

11.1

DSBGA Layout Guidelines.................................... 47

11.2

Layout Example .................................................... 48

11.3

Thermal Considerations of WQFN Package......... 48

12

Device and Documentation Support ................. 49

12.1

Documentation Support ........................................ 49

12.2

Trademarks ........................................................... 49

12.3

Community Resources.......................................... 49

12.4

Electrostatic Discharge Caution ............................ 49

12.5

Glossary ................................................................ 49

13

Mechanical, Packaging, and Orderable

Information ........................................................... 49

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision R (May 2015) to Revision S

Page

•

Added additional items to Applications .................................................................................................................................. 1

•

Changed symbol "

Changes from Revision Q (January 2015) to Revision R

Page

•

Added last sentence to "NOTE" .......................................................................................................................................... 21

Changes from Revision P (November 2014) to Revision Q

Page

•

Changed to new Default Device Options table with updated and additional values .............................................................. 3

•

Changed Handling Ratings table to ESD Ratings table ........................................................................................................ 6

•

Added updated Thermal Information ..................................................................................................................................... 7

Changes from Revision O (May 2013) to Revision P

Page

•

Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application

and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and

Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section .............. 1