LP3872, LP3875

SNVS227H – FEBRUARY 2003 – REVISED JANUARY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability

and specifications.

MIN

MAX

UNIT

Lead temperature (soldering, 5 sec.)

260

°C

Internally limited

IN pin to GND pin voltage

−0.3

7.5

V

Shutdown (SD) pin to GND pin voltage

−0.3

7.5

V

−0.3

6

V

Short-circuit protected

ERROR pin to GND pin voltage

V

SENSE pin to GND pin voltage

V

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings(1)(2) may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage.

(4)

If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.

(5)

The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get

forward biased if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically

withstand 200 mA of DC current and 1 A of peak current.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

(1)

2.5

7

V

Shutdown (SD) voltage

−0.3

7

V

1.5

A

Junction temperature

–40

125

°C

(1)

6.4 Thermal Information

LP3872, LP3875

LP3875

NDC (SOT-223)

KTT (TO-263)

NDH (TO-220)

UNIT

5 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

65.2

40.3

32

Junction-to-case (top) thermal resistance

47.2

43.4

43.8

Junction-to-board thermal resistance

9.9

23.1

18.6

°C/W

Junction-to-top characterization parameter

3.4

11.5

8.8

Junction-to-board characterization parameter

9.7

22

18

Junction-to-case (bottom) thermal resistance

n/a

1

1.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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