TL75LPxxQ SERIES

TL75LPxxY SERIES

LOW DROPOUT VOLTAGE REGULATORS

SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995

3−3

POST OFFICE BOX 655303

POST OFFICE BOX 1443

25 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

400 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation (see Note 2)

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. All voltage values are with respect to network terminal ground.

2. Refer to Figures 1 and 2 to avoid exceeding the design maximum virtual junction temperature; these ratings should not be exceeded.

Due to variation in individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may

be activated at power levels slightly above or below the rated dissipation.

DISSIPATION RATING TABLE

PACKAGE

POWER RATING

T

≤ 25°C

DERATING FACTOR

T = 70

°C

T = 85

°C

T = 125

°C

PACKAGE

POWER RATING

AT

T

≤ 25 C

POWER RATING

DERATING FACTOR

ABOVE T = 25

°C

T = 70 C

POWER RATING

T = 85 C

POWER RATING

T = 125 C

POWER RATING

TA

828 mW

6.62 mW/

°C

530 mW

431 mW

166 mW

PW

TA

TC

‡

828 mW

4032 mW

6.62 mW/ C

32.2 mW/

°C

530 mW

2583 mW

431 mW

2100 mW

166 mW

812 mW

PW

TC

TP‡

4032 mW

2475 mW

32.2 mW/ C

19.8 mW/

°C

2583 mW

1584 mW

2100 mW

1287 mW

812 mW

495 mW

‡ RθJP is the thermal resistance between the junction and the device pin. To determine the virtual junction temperature (TJ) relative to the device

pin temperature, the following calculations should be used: TJ = PD x RθJP + TP, where PD is the internal power dissipation of the device and TP

is the device pin temperature at the point of contact to the printed wiring board. The RθJP for the TL75LPxx series is 50.5°C/W.

600

400

200

0

25

50

75

100

800

1000

1200

125

150

1800

1600

1400

2000

2200

2400

MAXIMUM CONTINUOUS DISSIPATION

vs

FREE-AIR TEMPERATURE

TA − Free-Air Temperature − °C

1200

800

400

0

25

50

75

100

1600

2000

2400

125

150

3600

3200

2800

4000

4400

4800

TC − Case Temperature − °C

RθJA = 151°C/W

RθJC = 31°C/W

MAXIMUM CONTINUOUS DISSIPATION

vs

CASE TEMPERATURE

Figure 1

Figure 2