Absolute Maximum Ratings (Note 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage

V

CC

7V

V

EE

−7V

Maximum Power Dissipation (Note 1) at 25˚C

Cavity Package

1509 mW

Molded DIP Package

1476 mW

SO Package

1051 mW

Input Voltage

15V

Output Voltage (Power OFF)

Storage Temperature

−65˚C to + 150˚C

Lead Temperature

(Soldering, 4 seconds)

260˚C

Operating Conditions

Min

Max

Units

Supply Voltage

DS1691A

V

CC

4.5

5.5

V

V

EE

−4.5

−5.5

V

DS3691

V

CC

4.75

5.25

V

V

EE

−4.75

−5.25

V

Temperature (T

DS1691A

−55

+125

˚C

DS3691

0

+70

˚C

Note 1: Derate cavity package 10.1 mW/˚C above 25˚C; derate molded DIP

package 11.9 mW/˚C above 25˚C. Derate SO package 8.41 mW/˚C above

25˚C.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

RS-422 CONNECTION, V

≤ 0.8V

V

IH

High Level Input Voltage

2

V

V

IL

Low Level Input Voltage

0.8

V

I

IH

High Level Input Current

V

1

40

µA

V

IN

≤ 15V

10

100

µA

I

IL

Low Level Input Current

V

−30

−200

µA

V

I

Input Clamp Voltage

I

−1.5

V

V

O

Differential Output Voltage

R

V

3.6

6.0

V

V

O

V

A,B

V

−3.6

−6.0

V

V

T

Differential Output Voltage

R

Ω

V

2

2.4

V

V

T

V

A,B

V

CC

≥ 4.75V

V

−2

−2.4

V

V

Common-Mode Offset

R

Ω

2.5

3

V

Voltage

|V

Difference in Differential

R

Ω

0.05

0.4

V

Output Voltage

|V

Difference in Common-

R

Ω

0.05

0.4

V

Mode Offset Voltage

V

SS

|V

R

Ω,V

CC

≥ 4.75V

4.0

4.8

V

V

CMR

Output Voltage Common-

V

V

Mode Range

I

XA

Output Leakage Current

V

V

100

µA

I

XB

Power OFF

V

−100

µA

I

OX

TRI-STATE Output Current

V

V

CMR

≤ 10V

100

µA

V

V

CMR

≥ −10V

−100

µA

I

SA

Output Short Circuit Current

V

V

80

150

mA

V

−80

−150

mA

I

SB

Output Short Circuit Current

V

V

−80

−150

mA

V

80

150

mA

I

CC

Supply Current

18

30

mA

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