LM9071

SNVS131D – DECEMBER 1999 – REVISED APRIL 2013

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Tab and Backside metal on all packages internally connected to

ground.

Figure 3. 5-Lead TO-220 Package

Figure 4. 5-Lead TO-263 Surface Mount Package

Package Number NDH0005D

Package Number KTT0005B

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

DC Input Voltage

−26V to +40V

Positive Input Transient (t<100 ms)

60V

Negative Input Transient (t<1 ms)

−50V

Reset Output Sink Current

5 mA

Power Dissipation

Internally Limited

Junction Temperature

150°C

12 kV, 2 kV

Lead Temperature (Soldering, 10 seconds)

260°C

Storage Temperature

−50°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

All pins will survive an ESD impulse of ±2000V using the human body model of 100 pF discharged through a 1.5 k

Ω resistor. In addition

the input voltage pin will withstand ten pulses of ±12 kV from a 150 pF capacitor discharged through a 560

Ω resistor when bypassed

with a 22 nF, 100V capacitor.

Operating Ratings

(1)

Input Voltage

6V to 26V

Ambient Temperature

−40°C to +125°C

TO-220 Thermal Resistance,

3°C/W

TO-220 Thermal Resistance,

(2)

73°C/W

TO-263 Thermal Resistance,

3°C/W

TO-263 Thermal Resistance,

(3)

80°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

Exceeding the Maximum Allowable power dissipation will cause excessive die temperature, and the device will go into thermal

shutdown. The

package can be reduced by using conventional heat sink methods.

(3)

Exceeding the Maximum Allowable power dissipation will cause excessive die temperature, and the device will go into thermal

shutdown. The

package can be reduced by increasing the printed circuit board area that is connected (soldered) to the package tab. Using 1 ounce (1.4

mils thick) copper clad with no solder mask, an area of 0.5 square inches will reduce

reduce

copper clad area should be increased by at least 50% to maintain a similar

2

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