Not to scale

Thermal

Pad

2

1A1

3

2Y4

4

1A2

5

2Y3

6

1A3

7

2Y2

8

1A4

9

2Y1

12

1Y4

13

2A2

14

1Y3

15

2A3

16

1Y2

17

2A4

18

1Y1

19

2OE

Not to scale

Thermal

Pad

1

1A1

2

2Y4

3

1A2

4

2Y3

5

1A3

6

2Y2

11

1Y4

12

2A2

13

1Y3

14

2A3

15

1Y2

16

2A4

1

2

3

4

A

B

C

D

E

Not to scale

1A1

1OE

VCC

2OE

1A2

2A4

2Y4

1Y1

1A3

2Y3

2A3

1Y2

1A4

2A2

2Y2

1Y3

GND

2Y1

2A1

1Y4

Not to scale

1

1OE

20

VCC

2

1A1

19

2OE

3

2Y4

18

1Y1

4

1A2

17

2A4

5

2Y3

16

1Y2

6

1A3

15

2A3

7

2Y2

14

1Y3

8

1A4

13

2A2

9

2Y1

12

1Y4

10

GND

11

2A1

3

SN74LVC244A

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SCAS414AA – NOVEMBER 1992 – REVISED JUNE 2016

Product Folder Links: SN74LVC244A

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Copyright © 1992–2016, Texas Instruments Incorporated

5 Pin Configuration and Functions

ZQN Package

20-Pin BGA

Top View

DB, DGV, DW, N, NS, and PW Packages

20-Pin SSOP, TVSOP, SOIC, PDIP, SO, and TSSOP

Front View

RGY Package

20-Pin VQFN

Top View

RWP Package

20-Pin X1QFN

Top View

TI recommends to connect the exposed thermal pad to ground for best thermal performance. Must not be connected

to any other pin than ground.