SN74LVC112ADBLE datasheet(5/24 Pages) TI1

5 / 24 page

SN74LVC112A

www.ti.com

SCAS289M – JANUARY 1993 – REVISED DECEMBER 2014

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Operating

1.65

3.6

VCC

Supply voltage

Data retention only

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VIH

High-level input voltage

VCC = 2.3 V to 2.7 V

1.7

VCC = 2.7 V to 3.6 V

VCC = 1.65 V to 1.95 V

0.35 × VCC

VIL

Low-level input voltage

VCC = 2.3 V to 2.7 V

0.7

VCC = 2.7 V to 3.6 V

0.8

Input voltage

5.5

Output voltage

VCC

VCC = 1.65 V

–4

VCC = 2.3 V

–8

IOH

High-level output current

VCC = 2.7 V

–12

VCC = 3 V

–24

VCC = 1.65 V

VCC = 2.3 V

IOL

Low-level output current

VCC = 2.7 V

VCC = 3 V

Δt/Δv

Input transition rise or fall rate

ns/V

Operating free-air temperature

–40

125

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs (SCBA004).

7.4 Thermal Information

SN74LVC112A

THERMAL METRIC(1)

DGV

UNIT

24 PINS

RθJA

Junction-to-ambient thermal resistance

90.6

107.1

129.0

90.7

122.6

RθJC(to

Junction-to-case (top) thermal resistance

50.9

59.6

52.1

48.3

51.4

°C/W

RθJB

Junction-to-board thermal resistance

44.8

54.4

62.0

49.4

64.4

ψJT

Junction-to-top characterization parameter

14.7

20.5

6.5

14.6

6.7

ψJB

Junction-to-board characterization parameter

44.5

53.8

61.3

49.1

63.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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