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TLK2501IRCPR датащи(PDF) 14 Page - Texas Instruments |
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TLK2501IRCPR датащи(HTML) 14 Page - Texas Instruments |
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14 / 25 page ![]() TLK2501 1.5 TO 2.5 GBPS TRANSCEIVER SLLS427D − AUGUST 2000 − REVISED JULY 2003 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 built-in self-test (BIST) The TLK2501 has a BIST function. By combining PRBS with loopback, an effective self-test of all the circuitry running at full speed can be realized. The successful completion of the BIST is reported on the RX_ER/PRBS_PASS terminal. power-on reset Upon application of minimum valid power, the TLK2501 generates a power-on reset. During the power-on reset the RXD, RX_ER, and RX_DV/LOS signal terminals go to a high-impedance state. The RX_CLK is held low. The length of the power-on reset cycle is dependent upon the REFCLK frequency, but is less than 1 ms. absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VDD (see Note 1) −0.3 to 3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage range at TXD, ENABLE, GTX_CLK, TX_EN, TX_ER, LOOPEN, PRBSEN, LCKREFN −0.3 to 4 V . . . Voltage range at any other terminal except above −0.3 to VDD+0.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package power dissipation, PD See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrostatic discharge HBM:3 KV, CDM:1.5 KV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Characterized free-air operating temperature range, TA −40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground. DISSIPATION RATING TABLE PACKAGE TA ≤ 25_C POWER RATING DERATING FACTOR‡ ABOVE TA = 25_C TA = 70_C POWER RATING RCP64§ 5.25 W 46.58 mW/ _C 2.89 W RCP64¶ 3.17 W 23.70 mW/ _C 1.74 W RCP64# 2.01 W 13.19 mW/ _C 1.11 W ‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA). § 2 oz. Trace and copper pad with solder. ¶ 2 oz. Trace and copper pad without solder. # Standard JEDEC High-K board. For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI literature number SLMA002. electrical characteristics over recommended operating conditions PARAMETER TEST CONDITIONS MIN NOM MAX UNIT Supply voltage, VDD 2.3 2.5 2.7 V Supply current, ICC VDD = 2.5 V, Frequency = 1.5 Gbps, PRBS pattern 105 mA Supply current, ICC VDD = 2.5 V, Frequency = 2.5 Gbps, PRBS pattern 145 mA VDD = 2.5 V, Frequency = 1.5 Gbps, PRBS pattern 262 mW Power dissipation, PD VDD = 2.5 V, Frequency = 2.5 Gbps, PRBS pattern 362 mW Power dissipation, PD VDD = 2.7 V, Frequency = 2.5 Gbps, worst case pattern|| 500 mW Shutdown current Enable = 0, VDDA + VDD terminals = max 20 mA PLL startup lock time VDD,VDDA = 2.3V, EN ↑ to PLL acquire 0.1 0.4 ms Data acquisition time 1024 bits Operating free-air temperature, TA −40 85 °C || Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver. |
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