OBSOLETE

LM2575EP, LM2575HVEP

SNVS301B – DECEMBER 2004 – REVISED APRIL 2013

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TYPICAL PERFORMANCE CHARACTERISTICS (continued)

(Circuit of Figure 25)

Maximum Power Dissipation

Feedback Pin Current

Figure 20.

Figure 21.

Switching Waveforms

Load Transient Response

A: Output Pin Voltage, 10V/div

B: Output Pin Current, 1A/div

C: Inductor Current, 0.5A/div

D: Output Ripple Voltage, 20 mV/div,

AC-Coupled

Figure 22. Horizontal Time Base: 5

μs/div

Figure 23.

(1)

If the DDPAK package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to

the package: Using 0.5 square inches of copper area,

more square inches of copper area,

12

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