3

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R02

CPC44055ST

2

Thermal Characteristics

2.1 Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

2.2 Thermal Performance Data

Parameter

Conditions

Symbol

Rating

Units

Thermal Resistance (Junction to Case)

-



JC

0.35

°C/W

Thermal Resistance (Junction to Ambient)

Free Air



JA

27

°C/W

Junction Temperature (Operating)

-

-40 to +100

°C

θ

-

θ

JC

(T

P

D

T

T

θ

θ

P

* Elevated junction temperature reduces semiconductor lifetime.

NOTE: The exposed surface of the DCB substrate is not to be soldered.

Heat Sink Rating

Ambient Temperature (ºC)

0

1020

30

40

5060

70

8090

0

5

10

15

20

25

30

35

40

Output Power Dissipation

vs. Ambient Temperature

Heat Sink

2ºC/W

5ºC/W

10ºC/W

15ºC/W

No Heat Sink

Load Current (A

0

5

10

15

20

25

30

0

5

10

15

20

25

30

35

40

Output Power Dissipation

vs. Load Current