REV. 0

AD8328

–13–

20-Lead Frame Chip Scale Package [LFCSP]

4 mm

4 mm Body

(CP-20)

Dimensions shown in millimeters

1

20

5

6

11

16

15

BOTTOM

VIEW

10

2.25

2.10 SQ

1.95

0.75

0.55

0.35

0.30

0.23

0.18

0.50

BSC

12 MAX

0.25

REF

0.70 MAX

0.65 NOM

0.05

0.02

0.00

1.00

0.90

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

4.0

BSC SQ

CONTROLLING DIMENSIONS ARE IN MILLIMETERS

COPLANARITY

0.08

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1

0.60

MAX

0.60

MAX

20-Lead SOIC, 0.025 Lead Pitch [QSOP]

(RQ-20)

Dimensions shown in millimeters and (inches)

24

13

12

1

8.74 (0.3341)

8.56 (0.3370)

6.20 (0.2441)

5.79 (0.2280)

PIN 1

3.99 (0.1571)

3.81 (0.1500)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0039)

0.30 (0.0118)

0.20 (0.0079)

0.64 (0.0252)

BSC

1.50 (0.0591)

MAX

1.75 (0.0689)

1.35 (0.0531)

0.20 (0.0079)

0.18 (0.0071)

1.27 (0.0500)

0.41 (0.0161)

8

0

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

OUTLINE DIMENSIONS