CD74FCT574

BiCMOS OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP

WITH 3-STATE OUTPUTS

SCBS745 – JULY 2000

2

POST OFFICE BOX 655303

OE

1D

2

1D

3

2D

4

3D

5

4D

6

5D

11

CLK

1Q

19

2Q

18

3Q

17

4Q

16

5Q

15

6Q

14

7Q

13

8Q

12

7

6D

8

7D

9

8D

EN

1

C1

† This symbol is in accordance with ANSI/IEEE Std 91-1984 and

IEC Publication 617-12.

logic diagram (positive logic)

OE

CLK

1D

1Q

1

11

2

19

To Seven Other Channels

1D

C1

–0.5 V to 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

70 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–30 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

140 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through GND

400 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

69

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M package

58

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SM package

70

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.

recommended operating conditions (see Note 2)

MIN

MAX

UNIT

VCC

Supply voltage

4.75

5.25

V

VIH

High-level input voltage

2

V

VIL

Low-level input voltage

0.8

V

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

IOH

High-level output current

–15

mA

IOL

Low-level output current

48

mA

∆t/∆v

Input transition rise or fall rate

0

10

ns/V

TA

Operating free-air temperature

0

70

°C

NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.