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DLP4710

DLPS056B – NOVEMBER 2014 – REVISED JULY 2016

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Copyright © 2014–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 8

6.1

Absolute Maximum Ratings ..................................... 8

6.2

Storage Conditions.................................................... 8

6.3

ESD Ratings.............................................................. 9

6.4

Recommended Operating Conditions ....................... 9

6.5

Thermal Information ................................................ 11

6.6

Electrical Characteristics......................................... 11

6.7

Timing Requirements .............................................. 12

6.8

Switching Characteristics ....................................... 17

6.9

System Mounting Interface Loads .......................... 17

6.10

Physical Characteristics of the Micromirror Array . 18

6.11

Micromirror Array Optical Characteristics ............. 19

6.12

Window Characteristics......................................... 20

6.13

Chipset Component Usage Specification ............. 20

7

Detailed Description ............................................ 21

7.1

Overview ................................................................. 21

7.2

Functional Block Diagram ....................................... 21

7.3

Feature Description................................................. 22

7.4

Device Functional Modes........................................ 22

7.5

Window Characteristics and Optics ........................ 22

7.6

Micromirror Array Temperature Calculation............ 23

7.7

Micromirror Landed-On/Landed-Off Duty Cycle .... 24

8

Application and Implementation ........................ 27

8.1

Application Information............................................ 27

8.2

Typical Application .................................................. 28

9

Power Supply Recommendations ...................... 30

9.1

Power Supply Power-Up Procedure ...................... 30

9.2

Power Supply Power-Down Procedure .................. 30

9.3

Power Supply Sequencing Requirements .............. 31

10

Layout................................................................... 33

10.1

Layout Guidelines ................................................. 33

10.2

Layout Example .................................................... 33

11

Device and Documentation Support ................. 34

11.1

Device Support...................................................... 34

11.2

Related Links ........................................................ 34

11.3

Community Resources.......................................... 34

11.4

Trademarks ........................................................... 35

11.5

Electrostatic Discharge Caution ............................ 35

11.6

Glossary ................................................................ 35

12

Mechanical, Packaging, and Orderable

Information ........................................................... 35

4 Revision History

Changes from Revision A (May 2015) to Revision B

Page

•

Added links to DLP4710, DLPC3439, DLPA3000, and DLPA3005 in Description ................................................................ 1

•

Changed VRESET Max voltage in Absolute Maximum Ratings to match Figure 22 which had the correct value................ 8

•

Changed Micromirror tilt angle tolerance to ±1.4° in Micromirror Array Optical Characteristics .......................................... 19

•

Changed Micromirror crossover and switching time specification in Micromirror Array Optical Characteristics to

match actual operation values.............................................................................................................................................. 19

•

Changes from Original (November 2014) to Revision A

Page

•

Changed device status from Product preview to Production Data and released full version of the document .................... 1