3

20ETF..S

Bulletin I2111 rev. C 03/99

www.irf.com

T

J

Max. Junction Temperature Range

- 40 to 150

°C

T

stg

Max. Storage Temperature Range

- 40 to 150

°C

R

thJC

Max. Thermal Resistance Junction

0.9

°C/W

DC operation

to Case

R

thJA

Max. Thermal Resistance Junction

40

°C/W

to Ambient (PCB Mount)**

T

s

Soldering Temperature

240

°C

wt

Approximate Weight

2 (0.07)

g (oz.)

Case Style

D

Thermal-Mechanical Specifications

Parameters

20ETF..

Units

Conditions

Fig. 1 - Current Rating Characteristics

Fig. 2 - Current Rating Characteristics

Fig. 3 - Forward Power Loss Characteristics

Fig. 4 - Forward Power Loss Characteristics

Forrecommendedfootprintandsolderingtechniquesrefertoapplicationnote#AN-994

70

80

90

100

110

120

130

140

150

02468 10 12 14 16 18 20 22

30°

60°

90°

120°

180°

Conduction Angle

Average Forward Current (A)

20ETF.. Series

R

(DC) = 0.9 K/W

thJC

80

90

100

110

120

130

140

150

0

5

10

15

20

25

30

35

DC

30°

60°

90°

120°

180°

Conduction Period

Average Forward Current (A)

20ETF.. Series

R

(DC) = 0.9 K/W

thJC

0

5

10

15

20

25

30

35

0

5

10

15

20

25

RMS Limit

180°

120°

90°

60°

30°

Conduction Angle

Average Forward Current (A)

20ETF.. Series

T = 150°C

J

0

5

10

15

20

25

30

35

40

45

0

5

10

15

20

25

30

35

DC

180°

120°

90°

60°

30°

RMS Limit

Conduction Period

Average Forward Current (A)

20ETF.. Series

T = 150°C

J