3

I2124 rev. B 10/99

8EWF..S

T

J

Max.JunctionTemperatureRange

-40to150

°C

T

stg

Max.StorageTemperatureRange

-40to150

°C

SolderingTemperature

240

°C

for10seconds

R

thJC

Max.ThermalResistanceJunction

2.5

°C/W

DCoperation

toCase

R

thJA

Typ.ThermalResistanceJunction

50

°C/W

toAmbient(PCBMount)**

wt

ApproximateWeight

1(0.03)

g(oz.)

Case Style

TO-252AA(D-Pak)

Thermal-Mechanical Specifications

Parameters

8EWF..S

Units

Conditions

For recommended footprint and soldering techniques refer to application note #AN-994

Fig.1-CurrentRatingCharacteristics

Fig.3-ForwardPowerLossCharacteristics

Fig.4-ForwardPowerLossCharacteristics

Fig.2-CurrentRatingCharacteristics

60

70

80

90

100

110

120

130

140

150

01

23456

789

30°

60°

90°

120°

180°

Conduction Angle

Average Forward Current (A)

8EWF..S Series

R

(DC) = 2.5 °C/W

thJC

70

80

90

100

110

120

130

140

150

0

246

8

10

12

14

DC

30°

60°

90°

120°

180°

Conduction Period

Average Forward Current (A)

8EWF..S Series

R

(DC) = 2.5 °C/W

thJC

0

2

4

6

8

10

12

01

234

567

89

RMS Limit

180°

120°

90°

60°

30°

Conduction Angle

Average Forward Current (A)

8EWF..S Series

T = 150°C

J

0

2

4

6

8

10

12

14

16

0

246

8

10

12

14

DC

180°

120°

90°

60°

30°

RMS Limit

Conduction Period

Average Forward Current (A)

8EWF..S Series

T = 150°C

J