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ESDA13P70-1U1M датащи(PDF) 6 Page - STMicroelectronics |
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ESDA13P70-1U1M датащи(HTML) 6 Page - STMicroelectronics |
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6 / 10 page ![]() Recommendation on PCB assembly ESDA13P70-1U1M 6/10 DocID028170 Rev 1 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 14. Stencil opening dimensions b) General design rule Stencil thickness (T) = 75 ~ 125 µm 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 15. Recommended stencil window position Figure 16. Alternative stencil window position Aspect Ratio W T ----- 1.5 ≥ = Aspect Area LW × 2T L W + () ---------------------------- 0.66 ≥ = |
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