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TPC8201 датащи(PDF) 3 Page - Toshiba Semiconductor |
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TPC8201 датащи(HTML) 3 Page - Toshiba Semiconductor |
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3 / 7 page ![]() TPC8201 2003-02-20 3 Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit Gate leakage current IGSS VGS = ±16 V, VDS = 0 V — — ±10 µA Drain cut−off current IDSS VDS = 30 V, VGS = 0 V — — 10 µA Drain−source breakdown voltage V (BR) DSS ID = 10 mA, VGS = 0 V 30 — — V Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 0.8 — 2.0 V RDS (ON) VGS = 4 V, ID = 2.5 A — 58 80 mΩ Drain−source ON resistance RDS (ON) VGS = 10 V, ID = 2.5 A — 37 50 mΩ Forward transfer admittance |Yfs| VDS = 10 V, ID = 2.5 A 3 6 — S Input capacitance Ciss — 475 — Reverse transfer capacitance Crss — 85 — Output capacitance Coss VDS = 10 V, VGS = 0 V, f = 1 MHz — 270 — pF Rise time tr — 10 — Turn−on time ton — 16 — Fall time tf — 13 — Switching time Turn−off time toff — 70 — ns Total gate charge (Gate−source plus gate−drain) Qg — 16 — Gate−source charge Qgs — 11 — Gate−drain (“miller”) charge Qgd VDD ≈ 24 V, VGS = 10 V, ID = 5 A — 5 — nC Source−Drain Ratings and Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit Drain reverse current Pulse (Note 1) IDRP — — — 20 A Forward voltage (diode) VDSF IDR = 5 A, VGS = 0 V — — −1.2 V |
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